hpc-ch is glad to announce a talk and round table discussion by Mike Patterson, Senior Power and Thermal Architect at Intel Corporation:
Intel’s view on Data Center design and efficiency, challenges today and in the future – The focus lays on how to measure the efficiency and how the Datacenter owner can reduce their energy use, or apply more of it to the computational workload; Mike Patterson
April 9th, 12:00-14:30
ETH Zurich, Rämistrasse 101, 8006 Zurich
in the Building/Room HG F 33.1
Michael K Patterson is a Senior Power and Thermal Architect working in the Eco-Technology Program Office in the Intel Architecture Group at Intel Corporation, Hillsboro, OR, where he works on power and thermal solutions for Intel’s next-generation server, client, storage, and communications products. The work covers silicon level activity, through platform and rack level solutions, and on up to interface with Data Center power and cooling technologies. He did his undergraduate work at Purdue University, received his MS degree in Management from Rensselaer Polytechnic Institute, and was awarded his MS and PhD in Mechanical Engineering from the University of Vermont. His current technical interests include advanced closed-loop cooling systems, server power and thermal management technologies, server/datacenter interaction, and high density data center concepts. He has been with Intel for 17 years. He is a registered Professional Engineer. He is the Chairman of the Data Center Technology and Strategy Committee for the Green Grid. He is also a member of ASHRAE TC 9.9 and ASME.
The talk is open to all members and guest of hpc-ch.
To attend please register by sending an e-mail to delorenzi (at) cscs.ch until April 5th.
We would like to thank Anne Koessler of Intel Switzerland for having invited Mike to Switzerland for this round table.
We hope to meet many of you at this very interesting meeting.
For the organization committee
Michele De Lorenzi (CSCS) and
Vittoria Rezzonico (EPF Lausanne)